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Sn99Cu0,7Ag0,3 1.1.3

Low silver (LOW-SAC) lead-free alloy with flux for a wide range of industrial applications.

  • Pb Free
  • Low activity
  • Colophony-based
  • Halide free

Product name: Sn99Cu0,7Ag0,3 1.1.3
Alloy designation in accordance with ISO 9453:2014:
Sn99Cu0,7Ag0,3 (501)
Product type: Cored solder wire
Flux: 1.1.3

1. General characteristics

The solder was produced in the first smelt of tin, silver and copper. The composition of the solder complies with the ISO 9453:2014 standard. 1.1.3 solid flux is based on rosin and halide free formulations. Low silver lead-free alloy is intended for professional mechanized soldering in electronics where meeting the requirements of the RoHS2 Directive is required.

Sn99Cu07Ag03 038 100G Idx

2. Chemical compositions, mass fraction in %

Sn Ag Cu Bi Sb Cd Au In Pb Al As Fe Ni Zn
rest 0,20 - 0,40 0,50 - 0,90 max 0,06 max 0,10 max 0,002 max 0,05 max 0,10 max 0,07 max 0,001 max 0,03 max 0,02 max 0,01 max 0,001

3. Physical characteristics

Melting point: (solidus / liquidus)217 / 227°C
Density7,33 g/cm3
Electrical conductivityno data
Thermal conductivityno data
Tensile strength300 kgf/cm2
Elongation at break22 %
Hardness14 HB
Suggested operating temperatures340 - 420°C

4. 1.1.3 flux

acc. to DIN 8511SW32
acc. to ISO 94541.1.3B
acc. to J-STD-004ROM0
Flux content3,0 +/- 0,2% other on request
Halide content0,0%
Acid Value195 ±10 mg KOH/g
SIR test (PN-EN ISO 9455-17)no data avaliable

5. Other information

Available diameters

0,25 • 0,38 • 0,50 • 0,56 • 0,70 • 0,80 • 0,90 • 1,00 • 1,20 • 1,50 • 1,60 • 2,00 • 2,50 • 3,00 • 4,00 mm

other on request

Packed

50 g – cartons 120 pcs.
100 g – cartons 60 pcs.
250 g – cartons 5 kg
500 g – cartons 5 kg
1 kg – cartons 10 kg

other on request

Expiration date 3 years from the end of the year of production.
for example: batch 61112233 = date of production 2016, date of expiry 2019
Label Reels and cartons marked with alloy type, flux type, diameter, net weight and batch number.
Storage Store at room temperature, in a dry place and beyond the reach of children.

Files to download:

Sn99Cu0,7Ag0,3 1.1.3 - Technical data sheet

Sn99Cu0,7Ag0,3 1.1.3 - Safety data sheet

Physical, mechanical and chemical properties available in the TDS (download above).

PROCESSES

Find products by application

  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

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  • Minor assembly works which do not require professional equipment.

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  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

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  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

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  • For cable tinning and small scale soldering.

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  • For car body tinning, evening out and reconstruction before painting.

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  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework

PROCESSES

Find products by application

  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework
  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

    More
  • Minor assembly works which do not require professional equipment.

    More
  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

    More
  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

    More
  • For car body tinning, evening out and reconstruction before painting.

    More
  • Minor SMD and THT reworks and general electronic equipment repairs.

    More

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