Sn99,3Cu0,7 1.1.3

Lead-free solder alloy with flux, for universal use in electronics and electrotechnics.

Product name: Sn99,3Cu0,7 1.1.3
Alloy designation in accordance with ISO 9453:2014:
Sn99,3Cu0,7 (401)
Product type: Cored solder wire
Flux: 1.1.3

1. General characteristics

The solder was produced in the first smelt of tin and copper. The composition of the solder complies with the ISO 9453:2014 standard. 1.1.3 solid flux is based on rosin and halide free formulations. The solder alloy is intended for manual and automatic soft soldering where meeting the requirements of the RoHS2 Directive is required.

2. Chemical compositions, mass fraction in %

Sn	Cu	Bi	Sb	Ag	Cd	Au	In	Pb	Al	As	Fe	Ni	Zn
rest	0,50 - 0,90	max 0,10	max 0,10	max 0,10	max 0,002	max 0,05	max 0,10	max 0,07	max 0,001	max 0,03	max 0,02	max 0,01	max 0,001

3. Physical characteristics

Melting point: (solidus / liquidus)	227°C
Density	7,31 g/cm³
Electrical conductivity	0,126 μΩ•m
Thermal conductivity	66 W/m•K
Tensile strength	300 kgf/cm²
Elongation at break	21%
Hardness	9 HB
Suggested operating temperatures	340 - 420°C

4. 1.1.3 flux

acc. to DIN 8511	SW32
acc. to ISO 9454	1.1.3B
acc. to J-STD-004	ROM0
Flux content	3,0 +/- 0,2% other on request
Halide content	0,0%
Acid Value	195 ±10 mg KOH/g
SIR test (PN-EN ISO 9455-17)	no data avaliable

5. Other information

Available diameters	0,25 • 0,38 • 0,50 • 0,56 • 0,70 • 0,80 • 0,90 • 1,00 • 1,20 • 1,50 • 1,60 • 2,00 • 2,50 • 3,00 • 4,00 mm other on request
Packed	50 g – cartons 120 pcs. 100 g – cartons 30 pcs. / 3 kg 250 g – cartons 5 kg 500 g – cartons 5 kg 1 kg – cartons 10 kg other on request
Expiration date	3 years from the end of the year of production. for example: batch 61112233 = date of production 2016, date of expiry 2019
Label	Reels and cartons marked with alloy type, flux type, diameter, net weight and batch number.
Storage	Store at room temperature, in a dry place and beyond the reach of children.