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Sn63Pb37 SW21

An alternative to the most popular solder wire (Sn60Pb40) with flux, for professional use.

  • Contains Pb
  • High activity
  • Organic
  • Contains halides

Alloy designation in accordance with ISO 9453:2014: Sn63Pb37E*
Other known alloy markings: S-Sn63Pb37E*
Product type: Cored solder wire (with flux)
Flux: SW21

1. General characteristics

The product is intended for professional use. The solder Sn63Pb37E* was produced in the first smelt of tin and lead. The composition of the solder complies with the ISO 9453:2014 standard. SW21 is organic, water-soluble based, halide activated flux. The solder is soldering most metals except aluminum and stainless steel. It is basic leaded alloy for manual, automatic and robotic processes used in industrial applications in electronics and electrical engineering, where meeting the requirements of the RoHS2 Directive is not required.
* higher cleanliness class.

2. Chemical characteristics

2.1. Tin content: 63,0 ±0,5%
2.2. Lead content: rest
2.3. Composition and permissible impurities according to ISO 9453:2014:
Sn Pb Sb Bi Cd Cu Au In Ag Al As Fe Ni Zn
62,50 - 63,50 rest max 0,05 max 0,05 max 0,002 max 0,08 max 0,05 max 0,10 max 0,10 max 0,001 max 0,03 max 0,02 max 0,01 max 0,001

3. Physical characteristics

Melting point (solidus/liquidus)183°C
Density8,40 g/cm3
Electrical conductivity0,145 μΩ•m
Thermal conductivity50 W/m•K
Tensile strength525 kgf/cm2
Elongation at break37%
Hardness17 HB
Suggested operating temperatures340 - 400°C

4. SW21 flux

Organic, water-soluble based, halide activated flux. Special flux composition offers good solderability on various metal surfaces excluding aluminum and its alloys. Residues of flux after soldering are water washable if cleaning is necessary or required. The flux is exceptionally well suited for flame soldering.

Flux type acc. to DIN 8511SW25
Flux type acc. to ISO 94542.1.2B
Flux type acc. to J-STD-004ORH1
Flux content2,0 +/- 0,2%; 3 cores of flux (1 core or other flux content on request)
Halide content> 2,0%
Acid Valuenot applicable
SIR test (PN-EN ISO 9455-17)no data
WashabilityRecommended washing

5. Product description

Available diameters

0,25 • 0,38 • 0,50 • 0,56 • 0,70 • 0,80 • 0,90 • 1,00 • 1,20 • 1,50 • 1,60 • 2,00 • 2,50 • 3,00 • 4,00 mm

other on request

Packed

120 pcs /6 kg(50 g reels) cartons
60 pcs /6 kg(100 g reels) cartons
5 kg (250 g and 500 g reels) cartons
10 kg( 1 kg reels) cartons

other on request

Expiration date Three years from the end of the year of production for example: batch 61112233 = date of production 2016, date of expiry 2019.
Storage In original packaging at 5-20°C.
The recommended humidity level is 20-60%.
Keep away from strong oxidizing agents, acids, alkaline agents and beyond the reach of children.
Markings Reels and cartons marked with alloy type, flux type, diameter, net weight and batch number.

Files to download:

Sn63Pb37 SW21 - Technical data sheet

Sn63Pb37 SW21 - Safety data sheet

Physical, mechanical and chemical properties available in TDS (download above).

PROCESSES

Find products by application

  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

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  • Minor assembly works which do not require professional equipment.

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  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

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  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

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  • For cable tinning and small scale soldering.

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  • For car body tinning, evening out and reconstruction before painting.

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  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework

PROCESSES

Find products by application

  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework
  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

    More
  • Minor assembly works which do not require professional equipment.

    More
  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

    More
  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

    More
  • For car body tinning, evening out and reconstruction before painting.

    More
  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
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