• Banner Products

Sn63Pb37

The basic lead solder alloy in the form of solder wire, rod and bar for soldering applications in soldering aggregates where it is not required to meet the RoHS2 requirements.

  • Contains Pb
  • Wave soldering
  • Selective soldering
  • Dipping soldering
  • Tinning

Alloy designation in accordance with ISO 9453:2014:
Sn63Pb37 (101)
Product type: Solder bars and rods, Solder Wire

1. General characteristics

The product is intended for professional use. The solder Sn63Pb37 was produced in the first smelt of tin and lead. The composition of the solder complies with the ISO 9453:2014 standard. It is basic leaded alloy for manual, automatic and robotic processes used in industrial applications in electronics and electrical engineering, where meeting the requirements of the RoHS2 Directive is not required.

2. Chemical compositions, mass fraction in %

Sn Pb Sb Bi Cd Cu Au In Ag Al As Fe Ni Zn
62,50 - 63,50 rest max 0,05 max 0,05 max 0,002 max 0,08 max 0,05 max 0,10 max 0,10 max 0,001 max 0,03 max 0,02 max 0,01 max 0,001

3. Physical characteristics

Melting point (solidus/liquidus)183°C
Density8,40 g/cm3
Electrical conductivity0,145 μΩ•m
Thermal conductivity50 W/m•K
Tensile strength525 kgf/cm2
Elongation at break37%
Hardness17 HB
Suggested operating temperatures250 - 270°C

4. Other information

Available diameters

• 0,50 • 0,80 • 1,00 • 1,20 • 1,50 • 2,00 • 3,00 mm

other on request

Available cross-sections and sizes
cross-sections sizes [mm] cartons
Bar, rectangle with a Ø14 mm process hole 20x40x400 mm 26 kg
Bar, square 20x20x320 mm 25 kg
Rod, rectangle 7x21x350 mm 25 kg
Rod, square 20x20x330 mm 25 kg

other on request

Expiration date not applicable
Label The product is marked by a type of alloy or acc. to customer requirements.
Cartons, reels marked with a type of alloy, sizes, lot number and net weight.
Storage Keep away from strong oxidizing agents, acids and alkaline agents. The recommended humidity level is 20-60% and temperature is 5 – 20 °C.

Files to download:

Sn63Pb37 - karta techniczna

Sn63Pb37 - karta charakterystyki

Physical, mechanical and chemical properties available in the TDS (download above).

PROCESSES

Find products by application

  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

    More
  • Minor assembly works which do not require professional equipment.

    More
  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

    More
  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

    More
  • For car body tinning, evening out and reconstruction before painting.

    More
  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework

PROCESSES

Find products by application

  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework
  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

    More
  • Minor assembly works which do not require professional equipment.

    More
  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

    More
  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

    More
  • For car body tinning, evening out and reconstruction before painting.

    More
  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
Cookies make it easier for us to provide you with our services. With the usage of our services you permit us to use cookies.
More information Ok Decline