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Sn96,5Ag3Cu0,5 (SAC305) EVO

Basic lead-free solder wire with flux for a wide range of industrial applications.

  • Pb Free
  • Low activity
  • Colophony-based
  • Contains halides

Alloy designation in accordance with ISO 9453:2014: Sn96,5Ag3Cu0,5 (711)
Product type: Cored solder wire
Flux: EVO

1. General characteristics

The solder was produced in the first smelt of tin, silver and copper. The composition of the solder complies with the ISO 9453:2014 standard. EVO solid flux is a “no clean”, based on rosin and carefully selected activators. The flux EVO is intended for manual and automatic soft soldering. Solder wire meets the requirements of the RoHS2 Directive.

2. Chemical compositions, mass fraction in %

Sn Ag Cu Pb Sb Bi Cd Au In Al As Fe Ni Zn
rest 2,8 - 3,2 0,3 - 0,7 max 0,07 max 0,10 max 0,10 max 0,002 max 0,05 max 0,10 max 0,001 max 0,03 max 0,02 max 0,01 max 0,001

3. Physical characteristics

Melting point: (solidus / liquidus)217 / 220°C
Density7,38 g/cm3
Electrical conductivity0,132 μΩ•m
Thermal conductivity58 W/m•K
Tensile strength500 kgf/cm2
Elongation at break19%
Hardness15 HB
Suggested operating temperatures340 - 420°C

4. EVO flux

acc. to DIN 8511SW26
acc. to ISO 94541.1.2B
acc. to J-STD-004ROL1
Flux content3,0 +/- 0,2% other on request
Halide content 0,5 %
Acid Value195 ±10 mg KOH/g
SIR test (PN-EN ISO 9455-17)pass (above 100 MΩ)

5. Other information

Available diameters

0,25 • 0,38 • 0,50 • 0,56 • 0,70 • 0,80 • 0,90 • 1,00 • 1,20 • 1,50 • 1,60 • 2,00 • 2,50 • 3,00 • 4,00 mm

other on request

Packed

50 g – cartons 120 pcs.
100 g – cartons 30 pcs./3 kg
250 g – cartons 5 kg
500 g – cartons 5 kg
1 kg – cartons 10 kg

other on request

Expiration date 3 years from the end of the year of production.
for example: batch 61112233 = date of production 2016, date of expiry 2019
Label Reels and cartons marked with alloy type, flux type, diameter, net weight and batch number.
Storage Store at room temperature, in a dry place and beyond the reach of children.

Files to download:

Sn96,5Ag3Cu0,5 (SAC305) EVO - karta techniczna

Sn96,5Ag3Cu0,5 (SAC305) EVO - karta charakterystyki

Physical, mechanical and chemical properties available in the TDS (download above).

PROCESSES

Find products by application

  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

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  • Minor assembly works which do not require professional equipment.

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  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

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  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

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  • For car body tinning, evening out and reconstruction before painting.

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  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework

PROCESSES

Find products by application

  • Reflow Soldering
  • Manual Soldering & Repair
  • Wave Soldering
  • Selective Soldering
  • Dip Soldering
  • Car Body Renovation
  • Rework
  • Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).

    More
  • Minor assembly works which do not require professional equipment.

    More
  • Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).

    More
  • Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.

    More
  • For cable tinning and small scale soldering.

    More
  • For car body tinning, evening out and reconstruction before painting.

    More
  • Minor SMD and THT reworks and general electronic equipment repairs.

    More
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