Sn99,3Cu0,7
Lead-free solder alloy in the form of solder wires, solder bars and rods for use in soldering aggregates.
Alloy designation in accordance with ISO 9453:2014:
Sn99,3Cu0,7 (401)
Product type: Solder bars and rods, Solder Wire
1. General characteristics
The solder was produced in the first smelt of tin and copper. The use of a continuous casting process ensures minimization of the generation of oxides in the solder. As a result, the phenomenon of the formation of dross in the soldering process is significantly reduced. The composition of the solder complies with the ISO 9453:2014 standard. The solder alloy intended for mechanized soldering in electronics, electrical engineering and other industrial applications where meeting the requirements of the RoHS2 Directive is required.
2. Chemical compositions, mass fraction in %
Sn | Cu | Bi | Sb | Ag | Cd | Au | In | Pb | Al | As | Fe | Ni | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
rest | 0,50 - 0,90 | max 0,10 | max 0,10 | max 0,10 | max 0,002 | max 0,05 | max 0,10 | max 0,07 | max 0,001 | max 0,03 | max 0,02 | max 0,01 | max 0,001 |
3. Physical characteristics
Melting point: (solidus / liquidus) | 227°C |
Density | 7,31 g/cm3 |
Electrical conductivity | 0,126 μΩ•m |
Thermal conductivity | 66 W/m•K |
Tensile strength | 300 kgf/cm2 |
Elongation at break | 21% |
Hardness | 9 HB |
Suggested operating temperatures | 250 - 400°C |
4. Other information
Available diameters |
• 0,50 • 0,80 • 1,00 • 1,20 • 1,50 • 2,00 • 3,00 mm other on request |
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Available cross-sections and sizes |
other on request |
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Expiration date | not applicable | ||||||||||||||||||
Label | The product is marked by a type of alloy or acc. to customer requirements Cartons, reels marked with a type of alloy, sizes, lot number and net weight. |
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Storage | Keep away from strong oxidizing agents, acids and alkaline agents. The recommended humidity level is 20-60% and temperature is 5 – 20 °C |