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Lead-free solder alloy in the form of solder wires, solder bars and rods for use in soldering aggregates.

  • Pb Free
  • Dipping soldering
  • Wave soldering
  • Tinning

Alloy designation in accordance with ISO 9453:2014:
Sn99,3Cu0,7 (401)
Product type: Solder bars and rods, Solder Wire

1. General characteristics

The solder was produced in the first smelt of tin and copper. The use of a continuous casting process ensures minimization of the generation of oxides in the solder. As a result, the phenomenon of the formation of dross in the soldering process is significantly reduced. The composition of the solder complies with the ISO 9453:2014 standard. The solder alloy intended for mechanized soldering in electronics, electrical engineering and other industrial applications where meeting the requirements of the RoHS2 Directive is required.

2. Chemical compositions, mass fraction in %

Sn Cu Bi Sb Ag Cd Au In Pb Al As Fe Ni Zn
rest 0,50 - 0,90 max 0,10 max 0,10 max 0,10 max 0,002 max 0,05 max 0,10 max 0,07 max 0,001 max 0,03 max 0,02 max 0,01 max 0,001

3. Physical characteristics

Melting point: (solidus / liquidus)227°C
Density7,31 g/cm3
Electrical conductivity0,126 μΩ•m
Thermal conductivity66 W/m•K
Tensile strength300 kgf/cm2
Elongation at break21%
Hardness9 HB
Suggested operating temperatures250 - 400°C

4. Other information

Available diameters

• 0,50 • 0,80 • 1,00 • 1,20 • 1,50 • 2,00 • 3,00 mm

other on request

Available cross-sections and sizes
cross-sections sizes [mm] cartons
Bar, rectangle 20x40x350 mm 13 pcs. / 26 kg
Bar, rectangle 10x40x347 mm 25 pcs. / 25 kg
Bar, square 20x20x345 mm 20 pcs. /20 kg
Rod, triangle 12x12x400 mm 15 kg
Rod, semioval 8x12x420 mm 15 kg

other on request

Expiration date not applicable
Label The product is marked by a type of alloy or acc. to customer requirements
Cartons, reels marked with a type of alloy, sizes, lot number and net weight.
Storage Keep away from strong oxidizing agents, acids and alkaline agents. The recommended humidity level is 20-60% and temperature is 5 – 20 °C

Files to download:

Physical, mechanical and chemical properties available in the TDS (download above).

Processes

Find products by application

Reflow Soldering

Reflow Soldering

Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).
Manual Soldering & Repair

Manual Soldering & Repair

Minor assembly works which do not require professional equipment.
Wave Soldering

Wave Soldering

Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).
Selective Soldering

Selective Soldering

Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.
Dip Soldering

Dip Soldering

For cable tinning and small scale soldering.
Car Body Renovation

Car Body Renovation

For car body tinning, evening out and reconstruction before painting.
Rework

Rework

Minor SMD and THT reworks and general electronic equipment repairs.

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