Sn99Cu0,7Ag0,3 1.1.3
Product name: Sn99Cu0,7Ag0,3 1.1.3
Alloy designation in accordance with ISO 9453:2014:
Sn99Cu0,7Ag0,3 (501)
Product type: Cored solder wire
Flux: 1.1.3
1. General characteristics
The solder was produced in the first smelt of tin, silver and copper. The composition of the solder complies with the ISO 9453:2014 standard. 1.1.3 solid flux is based on rosin and halide free formulations. Low silver lead-free alloy is intended for professional mechanized soldering in electronics where meeting the requirements of the RoHS2 Directive is required.
2. Chemical compositions, mass fraction in %
Sn | Ag | Cu | Bi | Sb | Cd | Au | In | Pb | Al | As | Fe | Ni | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
rest | 0,20 - 0,40 | 0,50 - 0,90 | max 0,06 | max 0,10 | max 0,002 | max 0,05 | max 0,10 | max 0,07 | max 0,001 | max 0,03 | max 0,02 | max 0,01 | max 0,001 |
3. Physical characteristics
Melting point: (solidus / liquidus) | 217 / 227°C |
Density | 7,33 g/cm3 |
Electrical conductivity | no data |
Thermal conductivity | no data |
Tensile strength | 300 kgf/cm2 |
Elongation at break | 22 % |
Hardness | 14 HB |
Suggested operating temperatures | 340 - 420°C |
4. 1.1.3 flux
acc. to DIN 8511 | SW32 |
acc. to ISO 9454 | 1.1.3B |
acc. to J-STD-004 | ROM0 |
Flux content | 3,0 +/- 0,2% other on request |
Halide content | 0,0% |
Acid Value | 195 ±10 mg KOH/g |
SIR test (PN-EN ISO 9455-17) | no data avaliable |
5. Other information
Available diameters |
0,25 • 0,38 • 0,50 • 0,56 • 0,70 • 0,80 • 0,90 • 1,00 • 1,20 • 1,50 • 1,60 • 2,00 • 2,50 • 3,00 • 4,00 mm other on request |
Packed |
50 g – cartons 120 pcs. other on request |
Expiration date | 3 years from the end of the year of production. for example: batch 61112233 = date of production 2016, date of expiry 2019 |
Label | Reels and cartons marked with alloy type, flux type, diameter, net weight and batch number. |
Storage | Store at room temperature, in a dry place and beyond the reach of children. |